Semiconductor-AOI and measurement Series

AOI Machine (Six Sides)


This machine is applied for semiconductor packaging process and mainly used for the final products' appearance inspection.


  1. High-precision X/Y/Z Positioning ±002mm.
  2. Capable of inspecting BGA 120mm x 120mm and as small as >30um.
  3. Capable of inspecting the substrate /tinning ball /die /passive component and heat sinker.
  4. Special multi-angle light source method for various types of defects.
  5. Optional customized GUI/HMI and SECS/GEM function.
  6. Capable of integration of software and generate reports.