Semiconductor-AOI and measurement Series

AOI Machine (Solder Balling)


This machine is applied for semiconductor packaging process and mainly used for the quality inspection after ball mounting.


  1. High-precision X/Y/Z Positioning ±002mm.
  2. Friendly GUI/HMI.
  3. Capable of inspecting ball lacking/ bridge/different size.
  4. Capable of inspecting tinning ball with special light source.
  5. Optional customized GUI/HMI and SECS/GEM function.
  6. Capable of integration of loader and unloader for standalone operation.
  7. Capable of integration of unloader for Bin operation.